0hmX/am3352-zcz-footprint

This code defines the physical footprint and pin layout for an 18x18 ball grid array (BGA) package of a Texas Instruments AM3352 microprocessor, including pad positions and outline drawing commands for PCB design.

Version
1.0.2
License
unset
Stars
0

dist/index.d.ts

import * as react from 'react';

/** TI ZCZ0324A, top view: A1 upper left, numbers right, letters down.
 * Source: https://www.ti.com/lit/ds/symlink/am3352.pdf
 * Package outline / example board layout: PDF pages 260–261.
 * 15 × 15 mm body; 18 × 18 balls; 0.8 mm pitch; Ø0.40 mm NSMD lands.
 */
declare const rows: readonly ["A", "B", "C", "D", "E", "F", "G", "H", "J", "K", "L", "M", "N", "P", "R", "T", "U", "V"];
type Column = 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 | 16 | 17 | 18;
type AM3352Ball = `${typeof rows[number]}${Column}`;
declare const am3352Balls: {
    pin: `pin${number}`;
    ball: AM3352Ball;
    x: number;
    y: number;
}[];
declare const am3352BallLabels: Record<`pin${number}`, [AM3352Ball]>;
declare function AM3352ZCZFootprint(): any;

export { AM3352ZCZFootprint, am3352BallLabels, am3352Balls, AM3352ZCZFootprint as default };
export type { AM3352Ball };